Study on polishing methods for the hard-to-work material using unconventional nano carbon particle

Abstract

Improvement of polishing performance against the hard-to-work material is required to realize high throughput manufacturing process of the wafers. Recently, Doi has reported new polishing technology of the high efficiency polishing methods of the materials assisted by plasma. In this method, it is difficult to use conventional polishing device because of microwave resistance. We develop new nano carbon particle formed by UV laser irradiation against fullerenol and diamond particles for the polishing method and will report our experimental results.