Proceedings of JSPE Semestrial Meeting
2014 JSPE Autumn Conference
Session ID : G18
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Host: The Japan Society for Precision Engineering

Fabrication of Cu/Polyimide Multilayer Interconnections by Low Temperature Nanoimprint in Polyimide
*Kenta Suzuki, Sung-Won Youn, Hiroshi Hiroshima, Hideki Takagi
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Keywords: MEMS, polyimide, nanoimprint
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[in Japanese]
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© 2014 The Japan Society for Precision Engineering
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