2014 JSPE Autumn Conference
Session ID : L07
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Host: The Japan Society for Precision Engineering
The influence of polishing materials on the surface and sub-surface of SiC wafers in CMP process
*Kenji Kawata, Masayuki Sasaki, Yasuaki Itou, Kentaro Tamura, Masatake Nagaya, Takanori Kido, Tomohisa Kato, Tomohiro Nakayama
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