2014 JSPE Spring Conference
Session ID : Q32
Conference information
Host: The Japan Society for Precision Engineering
Material Removal Mechanism in Spiral Ultrasonic Assisted Grinding of Sapphire Wafer
Investigation of Ductile/Brittle Transition by Scratching Test using Single Diamond Tool
Keywords:
Spiral ultrasonic assisted grinding,
Sapphire wafer,
Material removal mechanism,
Ductile/brittle transition
Details
