2014 JSPE Spring Conference
Session ID : D15
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Host: The Japan Society for Precision Engineering
Development of the polishing process technology of the crystal substrate for green devices (5th Report)
Evaluation of the surface quality of the SiC substrate polished with the dilatancy pad
*Tsutomu Yamazaki, Kiyoshi Seshimo, Masanori Ohtsubo, Hiroshi Kashiwada, Hidekazu Tsuchida, Toshiro Doi
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