Abstract
Recently, Recently, diamond wheels with rotary in-feed face grinding mechanism are often used for wafer grinding in the thinning process or the planarization process, such as Si wafers, sapphire wafers and SiC wafers. The wafer grinding by use of a diamond grinding wheel is required to create a high-quality wafer surface. In general, it is known that the grinding performance of the grinding wheel is determined by the grinding wheel composition and grinding conditions. Especially, the cutting edge distribution of the grinding wheel working surface a significant effect on grinding force and surface roughness. In this study, we aim to understanding of the three-dimensional distribution of grains on diamond wheel working surface, from modeling of the fixed abrasive diamond wheel structure.
