Proceedings of JSPE Semestrial Meeting
2015 JSPE Spring Conference
Session ID : Q74
Conference information

High-efficient damage-free polishing of 4H-SiC by electrochemical mechanical polishing (1st report)
A study on increase in polishing rate
*Kazuya YamamuraKenji HosoyaHui DengYusuke ImanishiKatsuyoshi Endo
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
[in Japanese]
Content from these authors
© 2015 The Japan Society for Precision Engineering
Previous article Next article
feedback
Top