Abstract
Non-contact transfer methods are required for glass plates and semiconductor wafers while keeping them clean. In the proposed transfer method, a thin plate was slightly tilted by blowing and sucking air from orifice restrictors and airflow is blown against the lower side of the plate so that the driving force is generated. Two patterns were found experimentally. The plate was continuously carried by shifting the airflow pattern in accordance with the plate position. Slots to supply airflow were arranged with an interval of 15 mm. A stainless steel plate with dimensions of 90 mm x 100 mm x 2 mm and 139 g was transferred at an acceleration of 15 mm/s2.
