Production Prototyping of Polishing Pad Surface Asperity Pasted Upper Platen for Double Sided Polisher and Its Fundamental Examination

Abstract

The removal rate in CMP is affected by the polishing pad surface asperity. The relationship between the surface asperity and the removal rate is only discussed in the single-sided polisher. Moreover, it is well known that the contact image analysis device which uses the image rotation prism is effective for evaluating the surface asperity. However, the conventional device cannot evaluate the upper platen of the double-sided polisher (DSP). On the other hand, the DSP is frequently used for fabricating the high planarized substrate. This study demonstrates the characteristics of newly produced prototype device for measuring polishing pad surface asperity pasted upper platen of the DSP. This prototype device has a mechanism which can apply the measuring load to the image rotation prism by the spring load. In this paper, we tried the effectiveness evaluation on newly device from the viewpoint of the comparing the conventional device. As a result, it is founded that newly device has enough performance for measuring the surface asperity pasted the upper platen in the DSP.