Proceedings of JSPE Semestrial Meeting
2016 JSPE Spring Conference
Session ID : C07
Conference information

Visualization of Stress Distribution under Ultrasonic Vibration Cutting (3rd. report)
Cutting phenomenon under ultrasonic cutting condition with elastic deformation
*Hiromi IsobeKeisuke Hara
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
This paper reports the stress distribution inside of the workpiece under ultrasonically assisted orthogonal cutting (UAC) condition. It is widely noted that UAC reduces the average cutting force and cutting heat generation. However it is fundamentally difficult to observe the dynamic cutting process phenomenon with ultrasonic frequency band. In this research, stress field inside of the workpiece during UAC was observed by combining method consists of the pulse emitting source synchronized with ultrasonically vibrating cutting edge and the photoelastic method. It was observed the stress distribution changed synchronizing with tool vibration speed even if the intermittent cutting condition. The photograph captured by high-speed camera showed that the shear plane moved with vibrating cutting tool. It means that the conventional explanation of UVC based on relative position between tool and workpiece is insufficient.
Content from these authors
© 2016 The Japan Society for Precision Engineering
Previous article Next article
feedback
Top