Proceedings of JSPE Semestrial Meeting
2016 JSPE Spring Conference
Session ID : E62
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Host: The Japan Society for Precision Engineering

[title in Japanese]
*Kiyoshi Seshimo, Toshiro K. Doi, Tsutomu Yamazaki, Masanori Ohtsubo, Toshihiko Kanno, Taku Saeki, Tadakazu Miyashita
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Keywords: CMP, SiC, Polishing pad, Dilatant, Hibh efficiency process, Hibh quality process
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[in Japanese]
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© 2016 The Japan Society for Precision Engineering
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