2016 JSPE Spring Conference
Session ID : E79
Conference information
Host: The Japan Society for Precision Engineering
Visualization of Slurry Flow between Polishing Pad and Wafer in CMP (2nd Report)
Trial of visualization for investigate to influence of the pad wear
Keywords:
Chemical Mechanical Polishing,
Polishing Mechanism,
Pad Asperity,
Slurry Flow,
Visualization,
Transparent Visualization Model
Details
