Proceedings of JSPE Semestrial Meeting
2016 JSPE Spring Conference
Session ID : H66
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Host: The Japan Society for Precision Engineering

High precision and high efficiency slicing of SiC using multi-wire saw
*Junpei Okubo, Hitoshi Suwabe, Ken-ichi Ishikawa
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Keywords: multi-wire saw, resin corted-wire, diamond grain, slicng, SiC
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[in Japanese]
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© 2016 The Japan Society for Precision Engineering
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