Proceedings of JSPE Semestrial Meeting
2016 JSPE Spring Conference
Session ID : H81
Conference information

Host: The Japan Society for Precision Engineering

Room Temperature Wafer Bonding with Ultra Smooth Au Thin Film for Thermal Management of High Power Light Emitting Diode
*Ken Okumura, Eiji Higurashi, Tadatomo Suga
Author information
Keywords: room temperature bonding, Thermal management
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (651K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2016 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top