2018 JSPE Spring Conference
Conference information
Host: The Japan Society for Precision Engineering
Name : 2018 JSPE Spring Conference
Location : [in Japanese]
Date : March 15, 2018 - March 17, 2018
Investigation of the effect of grain size variation on ground wafer surface by grinding experiment/simulation
Yutaro Ebina, Tomohiro Maezaki, *Libo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima, Masatomo Inui
Author information
Keywords:
grinding wheel,
grain size,
standard deviation,
in-feed face grinding,
surface roughness,
wafer
Pages 85-86
Details
