Host: The Japan Society for Precision Engineering
Name : 2020 JSPE Spring Conference
Location : [in Japanese]
Date : March 17, 2020 - March 19, 2020
Pages 658-659
The nanoscale polishing phenomena between the substrate surface and polishing pad during process, such as CMP process, were observed and evaluated, in this report. The concept of observation method is applied the generated evanescent field to limit the observable region only on the surface being polished, and the detectable scattering light from the nanoparticles and polishing pad when they move close to the surface in a range of evanescent field. The detected scattering light intensity could be used for evaluating the phenomena. According to the observed results, there should have been more than two different phenomena in polishing; the particles adhering on the polishing pad, and the individual movement particles during moving. However, the phenomena being able to perform polishing, could not clearly identify yet.