Proceedings of JSPE Semestrial Meeting
2022 JSPE Spring Conference
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Development of Slurryless Ultrasonic-Assisted Electrochemical Mechanical Polishing Method for Hard-to-Finish Materials (Report 3)
Study of polishing for 4inch SiC wafers
*Haiyang GuXiaozhe YangXu YangKentaro KawaiKenta ArimaKazuya Yamamura
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Pages 127

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[in Japanese]
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© 2022 The Japan Society for Precision Engineering
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