Proceedings of JSPE Semestrial Meeting
2023 JSPE Autumn Conference
Conference information

Host: The Japan Society for Precision Engineering

Name : 2023 JSPE Autumn Conference

Location : [in Japanese]

Date : September 13, 2023 - September 15, 2023

Study on Non-contact Holding of φ300 Wafer Using Ultrasonic Squeezing Effect
*Yuto Nawa, Masaaki Miyatake, Kazumi Haga, Jyunji Konno
Author information
Keywords: Semiconductor Wafers, Ultrasonic Squeeze Effect, Non-contact Handling, Ultrasonic Vibration
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 365-366

Details
Download PDF (763K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2023 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top