Research on Atomic-Level Smoothing Process Using Only PMMA Plate and Water

Experimental investigation of chemical processing mechanisms using XPS and FTIR

Abstract

A low-cost, low-environmental impact, slurry-less atomic-level planarization process using only PMMA resin and water has been developed. The machining traces were obtained only under conditions machined with a PMMA tool in water, suggesting that the machining mechanism is based on chemical reactions. In this study, the PMMA tool and the processed silicon surface were analyzed using infrared spectroscopy and X-ray photoelectron spectroscopy, and it was shown that the C-O bonds on the PMMA surface are hydrolyzed during processing, and Si atoms are removed by the formation of C-O-Si bonds with Si atoms.