電極膜の製造条件最適化と機能性評価

抄録

In thick-film hybrid ICs, the circuit wiring is provided through formation of glaze-film wiring patterns for electrodes, resistors, and other devices on an alumina-based substrate. As a patteming evaluation method, many case studies using current-voltage characteristics have been presented so far. Those case studies used variations in process conditions as noise factors. Based on the quality engineering concept that noise consists in differenees in usage in the field, we proposed noise conditions derived from assumed usage conditions of the product after shipment, and tried these conditions out in a patterning evaluation. With suitable test patterns and deterioration conditions, optimization of the formation of thick-film hybrid IC eleetrode film patterns was achieved efficiently in a short time. Since our company procures thick-film materials from several material manufacturers, we alse studied efficient methods of evaluating those materials. The result suggested that thick-film materials could be evaluated efficiently through a comparison of wiring performance by Using functionality evaluation,