事例研究
BGAリフロー半田付けの最適化
2001 年 9 巻 2 号 p. 71-75
詳細
2001 年 9 巻 2 号 p. 71-75
In the re-flow soldering process, appearance inspection has been traditionally conducted. To improve the process, the cause and effect relationship between appearance and the process conditions are studied. With the development of high density mouting parts manufacturing technology in recent years, the appearance test can not be adopted any more. In order to use a high density mounting part for a new model, the re-flow process was reviewed and optimized without using the appearance test.
