軟ろう付用フラックスの作用機構に関する研究(第一報)
ステアリン酸の作用
1972 年 41 巻 11 号 p. 1300-1305
詳細
1972 年 41 巻 11 号 p. 1300-1305
The flux action of soldering has hardly been investigated in relation to chemical reaction. This research was carried out to clarify the relation between flux action of organic acid (stearic acid) and spreading phenomenon of solder; and the reactions between stearic acid and base metal (Cu) or between the flux and solder (Sn-Pb eutectic solder) were studied. The results obtained are summarized as follows:
1) The sperad obtained on oxidized copper using stearic acid flux is greater than on electropolished specimens.
2) Stearic acid reacts with copper oxide on heating to give copper stearate, as well as clean the surface of copper plate.
3) With stearic acid flux containing a littel of copper stearate, the area of spread increases very markedly.
4) Copper stearate reacts with melted solder to give stearic acid and copper metal.
From these results, the flux action of stearic acid may be considered as follows:
Stearic acid reacts with copper oxide to give copper stearate, which reacts with solder and a Cu-rich layer in outer surface of solder is formed. So, the spreading of solder on copper plate becomes better.
