Microstructure of Bonding Layer in Aluminum Nitride to Metals Joints Bonded by Active Brazing Method

Study on Bonding of Aluminum Nitride to Metals (Report 1)

Abstract

Brazing of AlN to metals was conducted at 1073-1293 K for 0-129.6 ks using active filler metals of Cu-22%Ti, Cu-10%Zr, Cu-15%Hf binary alloys and Ag-27%Cu-2%Ti ternary alloy. The reaction layer which was comprised of TiN, ZrN or HfN was formed at the bonding interface between AlN substrate and the brazing layer, and eutectic phases such as Cu-Cu₄Ti were detected in the brazing layer when binary filler metals were used for AlN to copper joining. TiN was identified in the reaction layer of AlN-molybdenum joint brazed using ternary filler metal. The thermodynamic calculation suggested that TiN, ZrN and HfN were produced by the interfacial reaction between AlN and active metals in the melted binary filler metals.