1988 Volume 6 Issue 2 Pages 238-244
The bonds in mass-produced electric devices are recently required high reliability in precision and in quality.
For the purposes, new bonding process for dissimilar metals by resistance heating is successfully developed.
To control the material deformation, the optimum electrode constitution of materials, sizes and their arrangement is established as described in Report-1 and Report-2.
To get high quality at bonds, the vapor shield process available to clean the material interface while bonding is developed as described in Report-3 and Report-4.
Moreover, inprocess control system for getting high quality bonds stably is newly developed and automatic bonder for mass-production line of contact-bars is successfully manufactured as described in Report-5.
In this study, main properties of contact-bars bonded by the new process which is operated in massproduction line are examined in comparison with the conventional one by brazing.
The main results obtained are as follows;
1) Bond strength increases of 40% as compared with the conventional one.
2) Temperature rise at bond by arcing heat input to the contact-top is sharply suppressed.
3) Bond strength at high temperature of 973 K is three times as high as the conventional one.
4) Hardness of carrier bar required spring property is kept at higher value.
5) Noticeable longer life of electromagnetic switchgears is confirmed by JEM-standard test.
