微細形状転写プロセスにおけるスタンパと溶融ポリマーとの粘着効果

抄録

To clarify the adhesion effects on the transcription of fine patterns to the surface of a thermoplastic polymer, the numerical simulation of the filling and transcription behavior in Melt Transcription Molding Process was carried out using a numerical model based on the adhesion between a molten polymer and a metal stamper with microstructure. The microstructure was completely transcribed at the initial stamper temperature 180℃. Up to this temperature, the rim height of transcribed hemispherical projection increased but the center height decreased, when the mold temperature was raised. The transcribed shapes simulated theoretically at the initial stamper temperature 170, 175 and 180℃ were closely duplicated with experimental ones which were reported in our previous study. Immediately after the release of compression force, the internal stress of the polymer filled near the contact interface changed from compression to tensile stress. From these results, it was confirmed that the adhesion force between the polymer filled in the microstructure and the metal mold surface keeps the transcribed shapes of the microstructure stable against the elastic recovery force. Furthermore, it was suggested that the adhesion effects play a critical role in successful operations of the coating, compression and demolding stages in Melt Transcription Molding Process.