抄録
In this study, development of conductive plastics was attempted by using soldering power as the conductive filler. But, it was difficult to get the uniform dispersal solder. And, in order to obtain stability in a solder dispersed conductive plastics, kneading experiments were performed in which the solder dispersed in the plastic was made even finer and a slight amount of short copper fibers was added to ensure good fluidity. The addition of the short copper fibers showed remarkable effects and was found to enable the solder to be dispersed even more finely. The results also confirmed that uniform and fine dispersal of the solder helps prevent surface defects caused by the stretching of the solder at the surface of injection molded product and the coagulation of the solder inside the conductive material. When the fibers are joined by the dispersed solder, conductivity is stable. However when the amount of solder is insufficient, conductivity was found to deteriorate, indicating that the joining of the fibers by solder is an important factor. Experiments confirmed that the addition of copper fibers and copper powder has little effect for increasing conductivity, but increasing the solder amount improves conductivity.
