Electrochemical Impedance Analysis for Growth Process of Electrochemical Migration on Screen-Printed Silver Wiring Electrode

- Effect of Temperature and Voltage -

Abstract

Effects of temperature and voltage on the growth process of electrochemical migration (ECM) for screen-printed silver wiring electrodes were investigated using electrochemical impedance spectroscopy.The reaction resistances for the anode and cathode decreased along with the decrease of temperature during the initial growth of a silver dendrite on the cathode surface. However, no change in the reaction resistance for the anode with temperature was observed immediately before short-circuiting of the silver wiring electrodes because the rate-determining step of the anodic reaction changed with dendrite growth from the charge transfer reaction of silver dissolution to the diffusion of the silver ion. Growth processes can be classified as four stages according to the time variation of the reaction resistances and solution resistance for voltages lower than 0.7 V.