Effect of Metal Nanorod Length on Adhesion of Electrolessly Plated Film on Silicon

Abstract

For the direct electroless deposition of adhesive metal films on Si substrates, we have developed a surface-activation process that forms metal nanorods in Si using electroless displacement metal nanoparticle deposition, metal-nanoparticle-assisted HF etching of Si, and autocatalytic electroless Ni deposition. The metal film adhesion increases with the metal nanorod length.