Use of Metal Oxide as a Cu/Glass Adhesion Promoting Layer

Abstract

Reliable and highly accurate Cu/glass structures are indispensable for the development of electronic device packaging technology. Nevertheless, adhesion between Cu and glass is well known to be poor. Atomic level interfacial bonding can be achieved using the interfacial reaction. This report describes the fabrication process of a high adhesion Cu/glass structure in which metal is doped onto the glass surface and a noble metal catalyst is applied to form a mixed layer before Cu deposition at room temperature. Different glasses were used as substrates, with ZnO as a metal doping source. Considerable adhesion improvement was confirmed for all test pieces, although the lack of alkaline components led to lowered adhesion strength. Metal oxides other than ZnO（In₂O₃, CuO, Fe₂O₃, and NiO）were used as dope sources for borosicilate glass substrates, all of which improved adhesion effectively.