Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Research Papers
Copper Plating on Through Glass Via(TGV)Using Both High-speed Sputtering Process and Wet Process
Masatoshi TAKAYAMAKotoku INOUEMitsuhiro WATANABE
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Keywords: Glass, TGV, Sputtering, Plating
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2021 Volume 72 Issue 9 Pages 503-507

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Abstract

Glass substrates with through-glass vias (TGVs) are being developed to improve large-volume and high-speed data communications technologies. To use the substrate as a circuit board, it is necessary to apply highly conductive Cu film on the glass substrate and to form uniform Cu film, even inside through holes. However, forming a uniform metal film on high-aspect-ratio through holes is difficult using conventional high-vacuum sputtering. Therefore, we specifically examined the throwing power of low-vacuum sputtering and formed a Cu film inside through holes of the TGV substrate using a wet plating process combined with sputtering. By selecting an appropriate Cu-plating solution and by optimizing Cu-plating conditions and plated film properties, annealing conditions, and an oxide film form method, we achieved 1.0 kN/m adhesion strength for a Cu film formed directly on a glass substrate. Results of our study also suggest the possibility of performing conformal plating on through holes having a 3.75 aspect ratio(0.3 mm glass thickness, φ80 μm opening diameter).

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