化学メッキ浴の調整と管理 (その1)

化学メッキに関する研究 (第5報)

抄録

Chemical Plating bath is different from electroplating bath, and unstable such as that nickel ion contained in the bath is deposited without catalizer under certain conditions, that pH and temperature of the bath affect quantity and quality of the deposit, that composition of the bath changes successively in the course of plating operation. The authors have been studying the control of the chemical plating bath, and the obtained data for controling the composition as well as variable factors of the chemical plating bath are herewith reported.
Reducing reagent must be added to the chemical plating bath within about one hour before the plating operation, then, pH is adjusted with ammonia water or sulfuric acid solution. Variable factors of chemical plating bath are nickel ion and hypophosphite ion concentration, pH, impurities, etc. Moreover, the temperature at plating operation affects quantity and luster of the deposit.