抄録
A new procedure of simultaneous determination of hypophosphite and nickel in electroless nickel plating solution by means of polarography, was proposed.
Excess copper sulfate was added to the mixed solution, and after the solution was Cheated and the copper powder reduced by hypophosphite was filtered, the remaining copper and nickel ion in the filtrate were measured by polarography. The content of hypophosphite was determined from the remaining copper value. It was found that this procedure is convenient to determine hypophosphite and nickel in plating solution.
