Abstract
Leveling action on bright nickel plating, with saccharine, naphtalenedisulfonic acid and butyndiol as addition agents, was studied by microphotography. Levelling ratio was increased in proportion to the quantity of butyndiol and decreased inversely to the quantity of current density and magnitude of notched angle on the surface of base metal (copper). Residual stress in metals electrodeposited from watts type bright nickel plating bath with saccharine, ethylenecyanhydrin, gelatin and butyndiol were measured by Hoar method. When saccharine and naphtalenedisulfonic acid, were added, compressive stress remained in the electrodeposit, but when added ethylencyanhydrin, gelatin and butyndiol, tensile stress remained.
