Abstract
The purpose of the present study was to find out the best conditions for electroplating of aluminum on copper or iron surface, using fused salt bath composed of 60% AlCl3, 25% NaCl and 15% KCl.
Moreover, the possibility of application of Al frit to the surface of copper or iron aluminum-electroplated under the best conditions was examined.
Result:-
1) It was prerequisite to cover AlCl3 under the process of fusing with NaCl and KCl, as well as to make pre-electrolysis.
2) As for plating conditions, it was best to keep current density 1.5A/dm2 against bath temperature 180°C and bath voltage 0.3V. After plating the plated metal should be immersed in benzene and washed with water.
3) When Al deposit was over 7μ thick, the adhesiveness of Al frit to the Al-plated copper was satisfactory, but that to the Al-plated iron was found to be poor.
