Abstract
The plating of indium-tin alloy for low melting solder was investigated. Four kinds of baths, i. e., fluoborate, chloride, sulfate, and cyanide were used in these experiments. The plating conditions, stabilities, current efficiencies, and surface conditions of deposits, were studied in each bath. The best results were obtained in cyanide bath, of which solubility was small.
Stability of plating bath and current efficiency were improved by adding Rochelle salt, an alkali salt of carboxylic acid, to cyanide bath to make it more effective.
