抄録
In this study, it was attempted to examine the properties of electrodeposited silver-copper alloys for contact materials.
The results obtained were as follows:
(1) The adhesive property of electrodeposited silver-copper alloy to substrate pure copper was almost in the same degree as that of the deposit in silver plating.
(2) It was found that silver was co-existent with copper by X-ray diffraction in the plated layers containing 20-96% of Cu.
(3) The maximum microhardness of the deposited alloys attained to about Hv 160.
(4) The wear resistance of the deposited alloys was higher than that of silver plated surface.
(5) The contact resistance of the deposited alloys was not higher than that of the deposit in silver plating.
