表面汚染と接着強サ

金属の表面汚染に関する基礎的研究 (第1報)

抄録

The relationship between adhesive strength and surface contaminations was studied by several experimental methods of surface chemistry including tracer technique. Electropolished metal surfaces were used as specimens because of their good reproducibility. They were quantatively contaminated with organic materials, for instance, by applying Langmuir-Blodgett technique. The results obtained were summarized as follows.
1) Copper: With the increase in the amount of adsorbed stearic acid, the adhesive strength between copper and polyvinyl acetate film was decreased. However, no further decrease of the strength was caused for the contamination of more than 3-molecular layers of stearic acid. Peeling of adhesive from the metal took place at the interface between the adhesive and the monolayer of stearic acid; while, it took place between the contaminated layers in the presence of multilayers of stearic acid. In the case of multilayer contamination by oleic acid, peeling occurred at the interface between the 1st and 2nd layers adherent to the metal surface.
2) Iron: The results similar to those in copper were obtained for stearic acid. The decrease in the adhesive strength by oleic acid was not so remarkable as in copper.
3) Stainless steel: For monolayer contamination of stearic acid, peeling took place between the monolayer and the metal surface; while, for the contamination by oleic acid, about a half of the monolayer remained on the metal surface after peeling.