抄録
The electroless plated ductile nickel layer was not obtained from the known electroless nickel plating baths generally used; but, it was obtained from the bath containing sodium acetate and sodium hypo-phosphite as a reducing agent at a slow deposition rate.
Among these baths, the conposition of 10g/l of nickel chloride, 5g/l of sodium hypo-phosphite, and 75g/l of sodium acetate gave a deposited layer of good appearance at a moderate deposition rate in practice.
It was found that the above bath was able to control the crack formation caused by bending of the electroless plated nickel layers, when the bath was adjusted with nitric acid to pH of about 5 and cobalt sulfate and saccharin as stress-relieving agents were further added to it. The bath temperature preferable was 80°C or higher.
