抄録
Copper-SiC alloys were electrodeposited from a copper-fluoborate electrolyte bath containing fine SiC particles suspended by mechanical agitation. The concentration of SiC in the alloys was determined by means of absorption photometry. Uniformity of the dispersion of SiC particles in the deposit and microstructure of the alloys annealed at various temperatures were examined by optical microscope, scanning electron microscope and X-ray diffraction. The relationship between annealing temperature or time versus micro-Vickers hardness of alloys, which is supposed to be proportional to yield stress, was investigated. In addition, abrasion and oxidation tests of the samples were carried out. The results obtained are summarized as follows: (1) The effect of dispersion-hardening was retained up to high temperatures such as 900°C and this was so with the increase of SiC content in the deposits. (2) The abrasion and oxidation resistances of Cu-SiC alloys were higher than those of copper deposit. (3) The recrystallization and grain growth of the matrix in the range of high temperatures were retarded in the presence of dispersed SiC particles.
