抄録
The leveling action of bright acid copper plating was investigated by using the Hull Cell test panel and the diagrams which universally show the relation between the geometric leveling power and the plating thickness as a function of the angle of the groov. The leveling powers were estimated at the various points of the Hull Cell test panel by measuring the surface roughness before and after plating and the plating thickness evaluated from the primary current distribution. The surface roughness was measured with the surface roughness tester. In spite of these easy and simple measurements, the leveling action in bright acid copper plating could be known universally on the diagrams as a function of the plating thickness, current density and the surface microprofile. Therefore, this method for the measurement of leveling was considered to be practically useful.
