抄録
The rise in temperature of the substrates in vacuum evaporation is a significant problem for the metallic coating of less heat-resistant materials. To reduce the temperature rise, evaporation is frequently conducted by use of shielding plates placed between the evaporation source and the substrates. This study has been made to determine the effect of the evaporation conditions on the rise in temperature of the substrates for the system having a shelter. The characteristics of the temperature rise for the shielded system are basically the same as those for the non-shielded system. Shielding has a marked effect on lowering the surface temperature for the substrate materials which otherwise are subjected to the rise in temperature. The temperature rise can be reduced, on average, to almost zero during evaporation. Prevention of the irradiation of the reflected heat radiation to the substrates, enabled by placing shielding plates, would be favorable for the measurements of the properties of evaporated films. It was also found that the temperature rise is influenced by the amount of absorption of reflected radiation as well as the evaporation energy value. The rise in temperature of the substrate materials for a definite thickness of evaporated films can be reduced with increasing deposition rate.
