硫酸塩浴からの銅-すず合金めっきに対する浴組成の影響
1980 年 31 巻 10 号 p. 550-554
詳細
1980 年 31 巻 10 号 p. 550-554
Electroplating of Cu-Sn alloys was studied by using the bath containing cupric sulfate, stannous sulfate, sulfuric acid, cresol sulfonic acid, Emulgen and benzalacetone. Copper deposited preferentially increased with increasing concentration of Cu2+ in the bath. The limiting current density for copper deposition increased with rising temperature and lustrous alloy layers were always obtained at potentials around -0.8V vs. S.C.E.
