無電解ニッケル系合金皮膜の電気抵抗と結晶化過程

抄録

The electric resistance behavior of chemically deposited Ni-P, Ni-B, and Ni-W-P alloy films at the initial deposition stage and with the heat treatment was investigated by means of film resistance measurements, X-ray diffraction analysis, and differential scanning carolimetry. At the initial deposition stage of the as-plated nickel alloy films, the stability and uniformity of electric resistance of Ni-W-P film were extremely superior to those of Ni-P and Ni-B films. The structural variation of Ni-P film was recognized at the lowest heat treatment temperature, while that of Ni-W-P film occurred at the highest heat treatment temperature. The stability of electric resistance of the films corresponded well to the structural variation with the heat treatment.