抄録
From our experimental study of the behavior of electrodes in cadmium plating, it has been found that the current density must be controled from 1.5A to 2A for relatively wide range of concentration of plating solution.
The defect usually found on the surface of cadmium layer kept in wet air for several days after plating, is that many little black stains by electro-chemical corrosion appear in the neighbourhood of local cell which consists of pits on the surface.
The peeling of the cadmium deposited layer from the base metal is one of the main troubles in the plating process.
This study leads to the conclusion that the poor adhesion of plated cadmium layer to the metal is occurred by the hydrogen gas diffused from the plating solution into the boundary of both metals through the cadmium layer.
