Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Behavior of Metallic Additives on Electrodeposition Reaction of Gold
Tsugito YAMASHITAMasaaki ITOYasuhiko IWAKIYoshiyuki ARAMAKI
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1989 Volume 40 Issue 11 Pages 1297-1299

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Abstract
The influence of metallic additives on the electrodeposition of gold has been studied by the impedance method.
The electrodeposition rate of gold was influenced when additives were included in the electrolyte, but the rate-determining step in the processes of gold deposition was scarcely influenced. The gold deposition was controlled by the chargetransfer reaction.
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