Abstract
Microcrystalization of Au-Cu or Au-As alloy plated films was investigated, and it was found that at low current densities the grain size of Au-Cu plated films tends to decrease with an increase in Cu concentration.
The above fact may be understood by considering the formation of an Au-Cu solid solution. The presence of As species in the Au plating baths raised the limiting current density and accelerated the rate of nucleation, so that the grain size of the Au-As film decreased. Pulse plating of Au, Au-Cu and Au-As alloys from sulfite baths was investigated with respect to the effect of pulse electrolysis on the grain size and morphology of the plated films. The results showed no difference between DC-plated and pulse-plated films.
