抄録
Recent trend of micro mechanical sensors based on silicon micromachining is described. Pressure, force, acceleration, angular rate and other mechanical quantities can be measured using the micro sensors. Wafer process packaging plays an important roles for low cost, reliable and small size sensors. High performance rotational gyroscope based on electrostatically levitated micro motor, electrostatically levitated spherical three-axis accelerometer, small size fiber optic pressure sensor and extremely sensitive resonation force sensors are described.
