Simultaneous Measurement of Film Thickness and Surface Profile of Film-Covered Objects by Using White-Light Interferometry

Abstract

In semiconductor and LCD manufacturing processes, film thickness and surface profile of film-covered objects are needed to be measured simultaneously. By using the vertical scanning white-light interferometry, an algorithm is developed that enables such simultaneous measurement. It works well for objects covered with not only thick film but also thin film. Experimental results are presented for film-covered surfaces consisting of approximately 70nm SiO2 film on silicon substrate.