Development of new high-effi ciency correction polishing technology using a small tool

Abstract

The correction polishing using a small tool is expected to be a technology for achieving highly effi cient polishing of semiconductor wafers. However, in correction polishing, high-precision control of the polishing pressure is required to prevent excessive removal in the planarization. Therefore, we have started to develop a new polishing load control system using an electric actuators. Furthermore, we have attempted to enhance a polishing removal amount using the electric slurry control technique. As the result, it was found that the variation of the removal amount decreased by 1/4 compared to the conventional load control system. Furthermore, the polishing removal amount was increased by 45 % at applied voltage 4kV. Therefore, we clarifi ed that the proposed polishing technology has the capability to obtain the high precision and rapid polishing.