Microstructural Design Techniques of High Thermally Conductive Composites Using Fillers

Abstract

Thermally conductive polymer composites offer new possibilities for the thermal management in electronic devices. An approach of current interest to improve the thermal conductivity of polymer composites is the addition of high thermally conductive fillers with different shape and size. This paper described an overview of the microstructural design techniques for polymer composites with high thermal conductivity, and recent progress and advances that have been made on the enhancement of thermal conductivity of the polymer composites.